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ECE · Q81

Electronic Devices And Circuits

Engineering and GATE · ECE · question 81

Q81

The main purpose of the metallization process is

A.
To supply a bonding surface for mounting the chip
B.
To protect the chip from oxidation
C.
To act as a heat sink
D.
To interconnected the various circuit elements
Answer

Answer: Option D

Solution

Answer: Option D
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