The semiconductor bar is heated at one end, a voltage across the bar is developed. If the heated end is positive, the semiconductor is
A. P-type
B. N-type
C. Intrinsic
D. Highly degenerated
Select an option to see the answer and solution.
In PN-junction diode, if doping concentration of acceptor atoms in P-region is increased then
A. depletion width in N-region will increase and contact potential will decrease
B. depletion width in P-region and N-region will decrease while contact potential remains constant
C. depletion width in P-region will decrease and contact potential will increase
D. None of the above
Select an option to see the answer and solution.
The output current versus input voltage transfer characteristics of an n-channel JFET is such that there is
A. zero current flow at zero input voltage bias
B. current flow only when a positive input threshold voltage is crossed
C. current flow only when a negative input cut-off voltage bias is crossed
D. no cut-off input voltage
Select an option to see the answer and solution.
Which of the following is correct?
A. Intrinsic and extrinsic semiconductors have negative temperature coefficient and conductors have positive temperature coefficient
B. Conductors and extrinsic semiconductors have negative temperature coefficient and intrinsic semiconductors have positive temperature coefficient
C. Insulators and semiconductors have positive temperature coefficient whereas conductors have negative temperature coefficient
D. Conductors and extrinsic semiconductors have positive temperature coefficient and pure semiconductors have negative temperature coefficient
Select an option to see the answer and solution.
Identify the correct statement about MOS capacitor-
A. For an N-type substrate, a negative voltage is applied and accumulation occurs
B. For a P-type substrate, a negative voltage is applied and accumulation occurs
C. For an N-type substrate, a positive voltage is applied and accumulation occurs
D. For a P-type substrate, a positive voltage is applied and an N-type inversion layer is formed
Select an option to see the answer and solution.
. . . . . . . . of the varactor-diode changes with the change in applied voltage.
A. Resistance
B. Reactance
C. Concentration of carrier
D. Temperature
Select an option to see the answer and solution.
The reverse saturation current of a silicon diode doubles for every
A. 10°K rise in temperature
B. 10°C rise in temperature
C. 2°C rise in temperature
D. 10°F rise in temperature
Select an option to see the answer and solution.
The leakage current in CE configuration may be around
A. Few nanoampers
B. Few microampers
C. Few hundred microampers
D. Few milliamperes
Select an option to see the answer and solution.
For the 2N338 transistor, the manufacturer specifies Pmax = 100 mW at 25°C free air temperature and the maximum junction temperature, Tjmax = 125°C. Its thermal resistance is
A. 10°C/W
B. 100°C/W
C. 1000°C/W
D. 10,000°C/W
Select an option to see the answer and solution.
The band gap energies for silicon and germanium photodiodes are 1.1 eV and 0.67 eV respectively, their cutoff wavelength respectively would be:
A. 1127.27 nm, 1850.75 nm
B. 1850.27 nm, 2167.91 nm
C. 456.12 nm, 1127.27 nm
D. 1315.45 nm, 1850.75 nm
Select an option to see the answer and solution.
Consider the following statements S1 and S2 .
S1 : The threshold voltage (VT ) of a MOS capacitor decreases with increase in gate oxide thickness.
S2 : The threshold voltage (VT ) of a MOS capacitor decreases with increase in substrate doping concentration.
Which one of the following is correct?
A. S1 is FALSE and S2 is TRUE
B. Both S1 and S2 are TRUE
C. Both S1 and S2 are FALSE
D. S1 is TRUE and S2 is FALSE
Select an option to see the answer and solution.
Consider the following statements
S1: Silicon is indirect bandgap semiconductor
S2: Germanium is direct bandgap semiconductor
S3: Gallium Arsenide is direct bandgap semiconductor
S4: Indium Phosphide is indirect bandgap semiconductor
A. S1 and S3 are correct
B. S2 and S4 are correct
C. S1, S2, S3 are correct
D. S2 and S3 are correct
E. Only S1 is correct
Select an option to see the answer and solution.
Which of the following statements are correct for the basic transistor amplifier configurations
A. CB amplifier has low input impedance and a low current gain
B. CC amplifier has low output impedance and a low current gain
C. CE amplifier has very poor voltage gain but very high input impedance
D. none of the above
Select an option to see the answer and solution.
The band gap in eV of Si at 300 K is:
A. 0.56 eV
B. 1.68 eV
C. 0.66 eV
D. 1.12 eV
Select an option to see the answer and solution.
Swept-out voltage in PIN diode happens when PIN diode is
A. Forward biased and the thickness of the depletion layer decreases till I-region becomes free of mobile carriers
B. Reverse biased and the thickness of the depletion layer increases till I-region becomes free of mobile carriers
C. Forward biased and the thickness of the depletion layer increases till I-region becomes free of mobile carriers
D. Reverse biased and the thickness of the depletion layer decreases till I-region becomes free of mobile carriers
Select an option to see the answer and solution.
What happens to a diode, if the PIV rating of the diode is exceeded?
A. Diode behaves as zener diode
B. Diode conducts poorly
C. Diode get destroyed
D. Diode stops conducting
Select an option to see the answer and solution.
The energy required to change the speed of one electron from rest to 0.6c is nearly:
A. 0.085 MeV
B. 0.13 MeV
C. 0.26 MeV
D. 0.37 MeV
Select an option to see the answer and solution.
When silicon is doped with arsenic, each arsenic atom will give the crystal . . . . . . . .
A. Two holes
B. Two electrons
C. One electron
D. One hole
Select an option to see the answer and solution.
In the fabrication of n-p-n transistor in an IC, the buried layer on the p-type substrate is
A. p+ -doped
B. n+ -doped
C. Used to reduce the parasitic capacitance
D. Located in the emitter region
Select an option to see the answer and solution.
Dominant mechanism for motion of charge carriers in forward and reverse biased silicon p-n junctions are
A. drift in forward bias, diffusion in reverse bias
B. diffusion in forward bias, drift in reverse bias
C. diffusion in both forward and reverse bias
D. drift in both forward and reverse bias
Select an option to see the answer and solution.