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ECE · all questions

VLSI Design And Testing
practice.

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Contact cuts are made in . . . . . . . . .

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The dopants are introduced in the active areas of silicon by using which process?

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Which is used for the interconnection?

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What are the advantages of E-beam masks?

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In nMOS fabrication, etching is done using . . . . . . . . .

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Depletion mode MOSFETs are more commonly used as . . . . . . . .

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Increasing Vsb . . . . . . . . the threshold voltage.

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Which process produces a circuit which is less prone to latch-up effect?

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Positive photo resists are used more than negative photo resists because . . . . . . . .

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N-well is formed by . . . . . . . .

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Which of the following is true when inputs are controlled by equal amounts of charge?

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Switching speed of a MOS device depends on . . . . . . . .

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MOS transistor structure is . . . . . . . .

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In latch-up condition, parasitic component gives rise to . . . . . . . . conducting path.

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The isolated active areas are created by technique known as . . . . . . . .

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Increasing the transconductance . . . . . . . .

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Latch-up is the generation of . . . . . . . .

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Transconductance gives the relationship between . . . . . . . .

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If p-transistor is conducting and has small voltage between source and drain, then it is said to work in . . . . . . . .

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Interconnection pattern is made on . . . . . . . .

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