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ECE · all questions

Electronic Devices And Circuits
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Match List-I with List-II and select the correct answer using the options given below:
List-I (Material) List-II (Energy Level)
a. p-type semiconductor at 0K temperature the conduction 1. Donor energy level is close to the conduction band
b. Intrinsic semiconductor at 0K temperature 2. Acceptor energy level is close to the valence band
c. n-type semiconductor at room temperature 3. Fermi-level is very close to valence band
d. p-type semiconductor at room temperature 4. Fermi-level is half way between the valence band the conduction band

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A lateral pnp device has base width of 10 µ and diffusion coefficient for base region is 20 cm2/sec. The base transit time is . . . . . . . .

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Which one of the following element has Forbidden energy band approximately equal to 6 eV?

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The barrier capacitance CT

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Match List-I with List-II and select the correct answer using the options given below:
List-I (Equation) List-II (Relation between/Description)
a. Continuity equation 1. Relates diffusion constant with mobility
b. Einstein's equation 2. Relates charge density with electric field
c. Poisson's equation 3. Relates flow with rate of change of concentration in space
d. Diffusion equation 4. Rate of change of minority carrier density with time

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Consider the following statements in a semiconductor crystal
1. As temperature increases lattice scattering increases.
2. Lattice Scattering is directly proportional to Doping levels.
3. As temperature increases mobility due to ionized impurity scattering increases.
4. As doping increases mobility due to ionized scattering decreases scattering events decreases.
Which of the following statements are correct?

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In a bipolar transistor at room temperature if the emitter current is doubled the voltage across its base-emitter junction is

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In a junction built - Potential depends on

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The n-channel MOS and p-channel MOS is turned off:

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A block of Silicon is doped with a donor atom density ND = 3 × 1014 atoms/cm3, and with an acceptor density of NA = 0.5 × 1014 atoms/cm3 find the resultant density of electrons.

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Which of following is most difficult to fabricate in IC?

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Which one of the following statements is TRUE for an 'ideal' power diode?

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The lower turn off time of MOSFET as compared to BJT is due to

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N-type materials are the type of materials formed by adding group . . . . . . . . elements to the semiconductor crystals.

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Consider avalanche breakdown in a silicon p+n junction. The n-region is uniformly doped with a donor density ND. Assume that breakdown occurs when the magnitude of the electric field at any point in the device becomes equal to the critical field Ecrit. Assume Ecrit to be independent of ND. If the built-in voltage of the p+n junction is much smaller than the breakdown voltage, VBR, the relationship between VBR and ND is given by

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Light color and visibility is determined in LED by

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If the reverse bias voltage increase, then what happen to diffusion capacitance.

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Which one of the following statements is correct in respect of the use of Direct Gap (DG) and Indirect Gap (IG) semiconductors in fabrication of Light Emitting diode?

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Match List-I with List-II and select the correct answer using the options given below:
List-I (Biasing of the junctions) List-II (Functions)
a. E-B junction forward bias and C-B junction reverse bias 1. Very low gain amplifier
b. Both E-B and C-B junctions forward bias 2. Saturation condition
c. E-B junctions reverse bias and C-B junction forward bias 3. High gain amplifier
d. Both E-B and C-B junctions reverse bias 4. Cut-off condition

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For material emitting 4 × 1014 Hz the band gap is . . . . . . . . eV.

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